Materials for high-density electronic packaging and interconnection.

By:

National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging

Material type: Text

TextPublication details: Washington, D.C. : National Academy Press, 1990.Description: 1 online resource (xiv, 139 pages) : illustrationsContent type:

text

Media type:

computer

Carrier type:

online resource

ISBN:

0585143951
9780585143958
030904233X
9780309042338

Subject(s):

Genre/Form:

Additional physical formats: Print version:: Materials for high-density electronic packaging and interconnection.DDC classification:

621.381/046 20

LOC classification:

TK7870 .N35 1990eb

Online resources:

Click here to access online

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Title notes ( 6 )

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Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

Available from Defense Technical Information Center, Cameron Station.

"NMAB-449."

Includes bibliographical references.

Print version record.

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