Normal view MARC view ISBD view

Materials for high-density electronic packaging and interconnection.

Materials for high-density electronic packaging and interconnection. - Washington, D.C. : National Academy Press, 1990. - 1 online resource (xiv, 139 pages) : illustrations

Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. Available from Defense Technical Information Center, Cameron Station. "NMAB-449."

Includes bibliographical references.

ISBN: 0585143951 9780585143958 030904233X 9780309042338

LCCN:

Subjects--Topical Terms:
Electronic packaging--Materials.
TECHNOLOGY & ENGINEERING--Electronics--Microelectronics.
TECHNOLOGY & ENGINEERING--Electronics--Digital.
Electronic packaging--Materials.

Index Terms--Genre/Form:
Electronic books.
Electronic books.

LC Class. No.: TK7870 / .N35 1990eb

Dewey Class. No.: 621.381/046

Print
Add to your cart (remove)
Send to device
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)