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Optoelectronic Packaging (Wiley Series in Microwave and Optical Engineering). by
  • Mickelson, Alan Rolf, edited
  • Basavanhally, N. R. (Nagesh R.)
  • Lee, Yung-Cheng
Series: Wiley series in microwave and optical engineering
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New York : Wiley, c1997
Availability: Items available for loan: FIRST CITY UNIVERSITY COLLEGE (1)Call number: 621.381045 OPT 1997.

Microelectronic systems /​ R. Vears. by
  • Vears, R. E
Series: GNVQ engineering series
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: Oxford : Butterworth Heinemann, 1996
Availability: Items available for loan: FIRST CITY UNIVERSITY COLLEGE (1)Call number: 621.381 VEA.

Packaging databook. by
  • Intel Corporation
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: Mt. Prospect, Ill. : Intel, c1996
Other title:
  • Packaging
Availability: Items available for loan: FIRST CITY UNIVERSITY COLLEGE (1)Call number: 621.381046 PAC 1996.

Advanced packaging [electronic resource] : an IHS Group publication.
Material type: Continuing resource Continuing resource; Format: electronic available online remote; Type of continuing resource: periodical
Publication details: Libertyville, Ill., USA : IHS Pub. Group, c1992-
Availability: No items available.

Advanced packaging [electronic resource] : an IHS Group publication.
Material type: Continuing resource Continuing resource; Format: electronic available online remote; Type of continuing resource: periodical
Publication details: Libertyville, Ill., USA : IHS Pub. Group, c1992-
Availability: No items available.

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