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Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies .
Material type:
TextSeries: Electronic packaging and interconnection seriesPublication details: New York : McGraw-Hill, 1999.Description: 1 v. (various pagings) : ill. ; 25 cmISBN: - 9780070410442
- 621.381 MAR 1999
- TK7870.23.M37 1999
| Item type | Current library | Home library | Collection | Shelving location | Call number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|---|
Open Collection
|
FIRST CITY UNIVERSITY COLLEGE | FIRST CITY UNIVERSITY COLLEGE | Open Collection | FCUC Library | 621.381 MAR 1999 (Browse shelf(Opens below)) | Available | 00007788 |
Total holds: 0