000			02927cam a2200589Ma 4500
001			ocm44958043
003			OCoLC
005			20200810093743.0
006			m o d
007			cr cn|||||||||
008			000807s1990 dcua ob 000 0 eng d
010			_z 90060385
040			_aN$T _beng _epn _cN$T _dOCL _dOCLCQ _dYDXCP _dOCLCQ _dNTE _dOCLCQ _dOCLCO _dOCLCQ _dOCLCF _dNLGGC _dOCLCQ _dSINTU _dOCLCQ _dAGLDB _dOCLCQ _dVTS _dINT _dOCLCQ _dWYU _dLVT _dSTF _dM8D
019			_a733801026 _a961612242 _a962704362 _a1053258813
020			_a0585143951 _q(electronic bk.)
020			_a9780585143958 _q(electronic bk.)
020			_a030904233X
020			_a9780309042338
029	1		_aDEBBG _bBV043146843
029	1		_aDEBSZ _b422563498
029	1		_aGBVCP _b80059715X
035			_a(OCoLC)44958043 _z(OCoLC)733801026 _z(OCoLC)961612242 _z(OCoLC)962704362 _z(OCoLC)1053258813
050		4	_aTK7870 _b.N35 1990eb
072		7	_aTEC _x008070 _2bisacsh
072		7	_aTEC _x008060 _2bisacsh
082	0	4	_a621.381/046 _220
049			_aMAIN
110	2		_aNational Research Council (U.S.). _bCommittee on Materials for High-Density Electronic Packaging. _0http://id.loc.gov/authorities/names/n90679380
245	1	0	_aMaterials for high-density electronic packaging and interconnection.
260			_aWashington, D.C. : _bNational Academy Press, _c1990.
300			_a1 online resource (xiv, 139 pages) : _billustrations
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
500			_aReport of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
500			_aAvailable from Defense Technical Information Center, Cameron Station.
500			_a"NMAB-449."
504			_aIncludes bibliographical references.
588	0		_aPrint version record.
590			_aeBooks on EBSCOhost _bEBSCO eBook Subscription Academic Collection - Worldwide
650		0	_aElectronic packaging _xMaterials.
650		7	_aTECHNOLOGY & ENGINEERING _xElectronics _xMicroelectronics. _2bisacsh
650		7	_aTECHNOLOGY & ENGINEERING _xElectronics _xDigital. _2bisacsh
650		7	_aElectronic packaging _xMaterials. _2fast _0(OCoLC)fst00907419
655		4	_aElectronic books.
655		0	_aElectronic books.
776	0	8	_iPrint version: _aNational Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging. _tMaterials for high-density electronic packaging and interconnection. _dWashington, D.C. : National Academy Press, 1990 _z030904233X _w(DLC) 90060385 _w(OCoLC)21437247
856	4	0	_uhttps://libproxy.firstcity.edu.my:8443/login?url=http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=14491
938			_aEBSCOhost _bEBSC _n14491
938			_aYBP Library Services _bYANK _n2309156
994			_a92 _bMYFCU
999			_c32188 _d32188