TY  - BOOK
AU  - Doyle,Jack S.
AU  - O'Quinn,Ryan C.
TI  - Adhesives: types, mechanics, and applications 
T2  - Materials science and technologies
SN  - 9781613248195
AV  - TA455.A34 
U1  - 620.1/99 23
PY  - 2011///
CY  - New York
PB  - Nova Science Publishers
KW  - Adhesives
KW  - TECHNOLOGY & ENGINEERING
KW  - Material Science
KW  - bisacsh
KW  - fast
KW  - Electronic books
N1  - Includes bibliographical references and index; Experimental analysis of the mechanical behaviour [i.e. behavior] of a ductile adhesive in a bonded joint under proportional tensile-shear loads / Jean Yves Cognard [and others] -- Pressure-sensitive adhesives / Zbigniew Czech and Agnieszka Kowalczyk -- Electrically conductive adhesives based on epoxy resins reinforced with carbon nanofilters / Silvia G. Prolongo, Mar�ia R. Gude and Alejandro Ure�na -- Antiadhesive layer for nanoimprint lithography / Jing Zhang [and others] -- On the design of press-fitted and adhesively bonded joints : static and fatigue tests in steel and aluminum connections / D. Croccolo, M. De Agostinis and N. Vinceni -- Tissue adhesives / Ankit Sarin, Govind Nandkumar and Gregory Dakin
UR  - https://libproxy.firstcity.edu.my:8443/login?url=http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=540063
ER  -