TY  - BOOK
ED  - National Research Council (U.S.).
TI  - Materials for high-density electronic packaging and interconnection
SN  - 0585143951
AV  - TK7870 .N35 1990eb
U1  - 621.381/046 20
PY  - 1990///
CY  - Washington, D.C.
PB  - National Academy Press
KW  - Electronic packaging
KW  - Materials
KW  - TECHNOLOGY & ENGINEERING
KW  - Electronics
KW  - Microelectronics
KW  - bisacsh
KW  - Digital
KW  - fast
KW  - Electronic books
N1  - Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council; Available from Defense Technical Information Center, Cameron Station; "NMAB-449."; Includes bibliographical references
UR  - https://libproxy.firstcity.edu.my:8443/login?url=http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=14491
ER  -