Materials for high-density electronic packaging and interconnection. 

 - Washington, D.C. :  National Academy Press,  1990. 
 - 1 online resource (xiv, 139 pages) :  illustrations 
<br/><br/> Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.  Available from Defense Technical Information Center, Cameron Station.  "NMAB-449." 
<br/><br/>Includes bibliographical references. 
<br/><br/><label>ISBN: </label>0585143951 9780585143958 030904233X 9780309042338 
<br/><br/><label>LCCN: </label>
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Materials.<br/>TECHNOLOGY & ENGINEERING--Electronics--Microelectronics.<br/>TECHNOLOGY & ENGINEERING--Electronics--Digital.<br/>Electronic packaging--Materials.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.<br/>Electronic books.
<br/><br/><label>LC Class. No.: </label>TK7870  / .N35 1990eb 
<br/><br/><label>Dewey Class. No.: </label>621.381/046