Lieberman, M. A <br/><br/>
Principles of Plasma Discharges and Materials Processing 

 - New York :  : Wiley,  , c1994. 
 - xxvi, 572 p. :  : ill. ;  ; 25 cm. 
<br/><br/> "A Wiley-Interscience publication.". 
<br/><br/>Includes bibliographical references (p. 559-564) and index. 
<br/><br/> Authored by two internationally respected pioneers in the field, this book offers a fully integrated, pedagogically consistent presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications - especially in the fabrication of integrated circuits. With many fully worked examples, practice exercises, and clear demonstrations of the relationship of plasma parameters to external control parameters and processing results, this book combines the best qualities of a student text and a professional resource. 
<br/><br/><label>ISBN: </label>9780471005773 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Plasma dynamics.<br/>Thin films--Surfaces.<br/>Plasma etching.<br/>Plasma chemistry.
<br/><br/><label>Dewey Class. No.: </label>530.4/4 LIE 1994